|
Required |
Recommended |
HW/Lab |
Post Date |
Due Date (solutions handout) |
Graded HW handout |
HW1 (ex 1.6, 1.8, 1.12, 1.16, 1.18) |
Jan 31 |
Feb 7 |
Feb 12 |
Feb 9 |
Feb 16 |
Feb 23 |
|
Feb 23 |
March 2 |
March 7 |
|
March 9 |
March 16 |
March 21 |
|
HW5 (ex 7.2, 7.4, 7.6, 7.10) |
April 4 |
April 11 |
April 22 |
April 22 |
May 7 |
May 7 |
Date |
Topic | PPT | Notes |
Wed 1/24
|
Introduction | ||
Fri 1/26
|
CMOS logic | lecture02 | |
Mon 1/29 |
CMOS fabrication | lecture03 | |
Wed 1/31
|
CMOS layout | lecture04 | First HW out |
Fri 2/2
|
Operation of MOS transistor (ideal) | lecture05 | |
Mon 2/5
|
Inverter DC transfer characteristics | lecture06 | |
Wed 2/7
|
Nonideal operation of MOS transistor | lecture07 | First HW due |
Fri 2/9
|
Circuit simulation using SPICE | lecture08 | Second HW out |
Mon 2/12 |
Design Layout using L-Edit | lecture09 | |
Wed 2/14 |
Delay Estimation | lecture10 | |
Fri 2/16 |
Logical Effort (1/2) | lecture11 | Second HW Due. |
Mon 2/19 |
President Day holiday | ||
Wed 2/21 |
Logical Effort (2/2) | lecture12 | |
Fri 2/23 |
Power dissipation | lecture13 | Third HW out |
Mon 2/26 |
Interconnects | lecture14 | |
Wed 2/28 |
Wire Engineering | lecture15 | |
Fri 3/2 |
Scaling theory | lecture16 | Third HW due |
Mon 3/5 |
Static CMOS combinational design (1/2) | lecture17 | |
Wed 3/7 |
Static CMOS combinational design (2/2) | lecture18 | |
Fri 3/9 |
Dynamic CMOS combinational design | lecture19 | Fourth HW out |
Mon 3/12 |
Circuit Design Pitfalls | lecture20 | |
Wed 3/14 |
Differential/Sense amplifier circuits | lecture21 | |
Fri 3/16 |
Material Review | lecture22 | Fourth HW due |
Mon 3/19 |
Sequencing circuits (1/3) | lecture23 | |
Wed 3/21 |
Midterm | ||
Fri 3/23 |
Office hours instead | ||
Spring Break |
|||
Mon 4/2 |
Sequencing circuits (2/3) | lecture24 | |
Wed 4/4 |
Sequencing circuits (3/3) | lecture25 | Fifth HW out |
Fri 4/6 |
Project Overview | lecture26 | |
Mon 4/9 |
Datapath systems (1/3) | lecture27 | |
Wed 4/11 |
Class canceled | ||
Fri 4/13 |
Datapath systems (2/3) | lecture28 | Fifth HW due |
Mon 4/16 |
Datapath systems (3/3) | lecture29 | |
Wed 4/18 |
Design methods (using Tanner Tools) | lecture30 | |
Fri 4/20 |
Array Subsystems (1/3): SRAM | lecture31 | |
Mon 4/23 |
Array Subsystems (2/3): DRAM/ROM | lecture32 | |
Wed 4/25 |
Arrays Subsystems (3/3): PLDs/FPGAs | lecture33 | |
Fri 4/27 |
Design Methods (beyond Tanner Tools) | ||
Reading Period
|
|||
Mon 5/7 |
Project Presentations
|
6th HW due |
|
Thur 5 /17 |
Final Exam @ 9AM B & H 165 |
The objective of the class project is to develop a protoype for an 8-bit subset of the MIPS processor in 0.5micron AMI process. Please see Lecture26 and Chapter 1 in your book for more details about the design of the processor. The entire class will collaborate on the design process, where each team takes a module of the processor and prototype it. An intergator will "stitch" the modules together to form the processor. The project proceeds in four phases:
Phase I (4-11 April). Standard Cell Library Design. Please make sure to functionally verify your cell design and include area/timing/power numbers in your report.
| Assignee | Cell |
| Brendan | AOI22 |
| Brian | NOR2 / NOR3 |
| Candice | D Latch/FF |
| Jon | NAND2 / NAND3 |
| Luis | Tri-State buffer |
| Mike | Integration and verification |
| Nuno | Xor |
| Sherief | Inverter and Mux |
| Yiwen | AOI21 |
Phase II (11-18 April). Module Specification. You are required to study your part of the CPU and make sure you write down the input-output interface of your module as well as its specification.
| Team | Module |
| Brendan - Candice | FSM controller |
| Nuno-Yiwen | ALU |
| Mike | ALU control |
| Luis | Register file |
| Brian | Integration |
Phase III (18-27 April). Module Prototyping. It is time to start designing and protoyping your module. In your report, make sure to include your (a) prototype layout, (b) functional (c) timing/area/power numbers. Make sure to provide clear description of how did you try to optimize / constrain your design in terms of area, time, power, and reliability.
Phase IV ( 28 April - 7 May) CPU Integration. Integration and presentation preparation. Brian have full authority to revise with you your design until it is 100% correct. He also has to piece together all the pieces to produce a functional IC prototype. He will report estimates of (1) the area (1) the speed, and (2) the power consumption of the processor.
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Total Area:
1.73 mm2. #Cells = 1346 |
Total Wirelength = 57.6 cm |
Clock Frequency = 15MHz |
Power Consumption = 10.8mA |
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