Research Projects
1. Yield management and Cost-effective design techniques for 3D integrated circuits
Project supported by a generous gift from Qualcomm Corporation.
Publications
- [P3] S. Reda, G. Smith and L. Smith, "Maximizing the Functional Yield of Wafer-Wafer 3D Integration," to appear in IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
- [P2] C. Ferri, S. Reda and R. I. Bahar, "Parametric Yield Management for 3D ICs: Models and Strategies for Improvement," to appear in ACM Journal on Emerging Technologies in Computing Systems , Special Issue on 3D ICs, 2008.
- [P1] C. Ferri, S. Reda and R. I. Bahar, "Strategies for Improving the Parametric Yield and Profits of 3D ICs," Proc. International Conference on Computer-Aided Design, 2007, pp. 220-226.
Modeling and analysis of process variations in sub-100nm CMOS circuits
Project supported by equipment donation from Altera Corporation.
Publications
- [P1] B. Hargreaves, H. Hult and S. Reda, "Intra-die Process Variations: How Accurately can They Be Statistically Modeled?" Proc. Asia-Pacific Design Automation Conference, 2008, pp. 524-530. Best Paper Candidate.
Performance and Thermal management for multi-core processors
Publications
- [P1] M. Kadin and S. Reda, "Frequency and Voltage Planning for Multi-Core Processors Under Thermal Constraints," to appear in International Conference on Computer Design, 2008.
- [P2] M. Kadin and S. Reda, "Frequency Planning for Multi-Core Processors Under Thermal Constraints," to appear in International Symposium on Low Power Electronics and Design, 2008.
- [P3] D. Meisner and S. Reda, "Hardware Libraries: An Architecture for Economic Acceleration in Soft Multi-Core Environments," Proc. International Conference on Computer Design, 2007, pp. 189-196.